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	Features Specifications Ordering Information Datasheet

• Onboard VIA Eden™-V4 / C7™ processors
  Up to 2.0GHz, 400/533MHz FSB
• 1x DDR2 SO-DIMM, Max. 1GB
• Integrated VGA, 10/100BaseT LAN
• Supports 18-bit/24-bit dual channel LVDS
• 4x USB 2.0, 2x COM

CPU Supported
VIA Eden-V4 or VIA C7 processors

CPU Voltage
1.004V~1.148V

Chipset
VIA CN700 Chipset
North Bridge: VIA CN700
South Bridge: VIA VT8237R+

Processor Operating Frequency
400MHz / 533MHz / 800MHz

L2 Cache
128KB (CPU integrated)

Power Management
APM 1.2

BIOS
Award BIOS, ACPI supported

System Memory
One DDR2 SO-DIMM socket
Supports DDR200/266/333/400 SDRAM
Max. 1GB

VGA
VIA CN700 built-in 128-bit Unichrome Pro 3D/2D controller
Supports 16/32/64MB frame buffer size

LVDS
VIA VT1636 dual channel LVDS transmitter
Supports 18/24-bit dual LVDS

LAN
LAN1: VIA 8237R+ built-in 10/100 LAN

Audio
VIA VT8237R+ built-in audio controller with VIA VT1616 AC97 codec

LPC I/O
Winbond 83627EHF supports Parallel x 1, COM1, IrDA
COM2 (RS232), FDC (slim type), hardware monitoring

PCI to ISA
ITE IT8888G PCI to ISA bridge single function device

FDD Interface
Supports one 3.5" disk drive
Slim type connector

ETX Interface
ETX connector x 4
Interface for PCI bus, ISA bus, USB, audio, VGA, LVDS, LAN, IDEs, COM ports, Parallel port, Keyboard / mouse

Other Features
Smart Fan, Wake On LAN

Form Factor
ETX CPU Module

Dimensions
95mm x 114mm

Power Consumption
TBC

Environmental Factors:

Operating Temperature

0°C~60°C (32°F~140°F)

Storage Temperature

-20°C~80°C (-4°F~176°F)

Relative Humidity

10%~90% (non-condensing)