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IBC700 SPECIFICATIONS
CPU
Intel® Mobile Pentium III/Celeron (BGA2)
(low power, low voltage, no CPU fan)
400MHz~500MHz
CPU Front Side Bus
100MHz
Chipset
Intel® 440BX AGPset
Intel® 82443BX (PAC) 492-pin BGA
Intel® 82371EB (PIIX4) 324-pin BGA
L2 Cache
128K/256K CPU integrated
BIOS
Award Flash BIOS
System Memory
Two (2) DIMM sockets
Supports up to 512MB memory capacity
PC100 SDRAM modules type
VGA
SMI SM721G4 with 4MB embedded memory
Supports CRT & LCD displays
Dual independent display
Ethernet
Two (2) Intel® 82559 Fast Ethernet controllers
10BaseT/100BaseTX, full duplex
Two RJ-45 connectors, Link/Active LEDs on board
Complies with IEEE802.3, IEEE 802.3x Ethernet specifications
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FEATURES
- Intel®
Mobile Pentium III/Celeron processor on board, no CPU fan required
- Intel® 440BX chipset, 100MHz front side bus
- Two DIMM sockets support up to 512MB
- Dual Intel® 82559 LAN, two RJ-45 connectors on board
- SMI SM721G4 VGA controller supports LVDS and TTL LCD interface
- On board PMC, PCI to PCI bridge, DiskOnChip interface, two USB ports
Super I/O
Winbond 83977 Super I/O chipset
Supports IrDA x 1, Parallel x 1, COM1, COM2, FDC (2.88MB, 3 Mode),
keyboard and mouse
Front side I/O connectors include COM1, COM2 and LPT1 Dsub type; all
other signals supported on the rear panel
PCI to PCI Bridge
TI TI2020/Intel® 21150 PCI to PCI Bridge chipset
32 bit operation
PMC Connector
On board PMC connector supports optional Ethernets, PCI SCSI devices,
etc.
USB
Two (2) USB ports on the front panel
Solid State Disk Interface
Onboard DiskOnChip socket supports M-Systems DiskOnChip flash disk of
2MB~144MB capacity
Keyboard and Mouse Connector
Combo PS/2 type (keyboard & mouse)
Form Factor
6U Compact PCI Board
Single-slot: 0.8" (20.3mm)
Dimensions
233mm x 160mm (9.2" x 6.3")
Environmental Factors:
Operating Temperature:
0°C~60°C (32°F~140°F)
Storage Temperature:
-20°C~80°C (-68°F~176°F)
Relative Humidity:
10%~90% (non-condensing)
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